Targeting IoT and virtual reality (VR) applications, what is claimed to be the world’s lowest power wireless smart sensor development kit has been released by Dialog. It comprises the company’s DA14583 SmartBond Bluetooth Smart SoC, combined with Bosch Sensortec’s gyroscope, accelerometer, magnetometer, and environmental sensors on a small PCB that measures just 16 x 15mm.
Wearable
Audio jack detector and analogue switch are used in portable applications
Offering a space-saving alternative to miniQFN10 and WCSP devices, the Vishay Siliconix DG2592 audio jack detector and DG2750, low voltage, dual SPDT analogue switch have a slim profile of just 0.35mm and measure 1.4 x 1.8mm. Typical miniQFN10 and WCSP packages feature profiles of 0.55 mm. The thin miniQFN10 package of both devices is 36% thinner, allowing for slimmer handheld healthcare instruments, smartphones, tablets, portable media players, digital cameras, and wearable IoT devices. Compared to WCSP packages, the package is claimed to offer easier surface mounting and is better suited for the flexible PCBs commonly used in portable designs.
Automotive SoCs implement 3D graphics clusters
The first member of SoC in the R-Car family have been announced by Renesas. They can be used in 3D instrument cluster systems and provide a migration path as more automotive systems are expected to shift to 3D graphics instrument cluster systems in the near future.
MCUs boost efficiency to energy-sensitive devices
Volume production has begun for the energy-efficient ARM Cortex-M0+ STM32L0 microcontrollers. There is a development ecosystem including minimal-cost boards and free software tools.
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