Low-power Bluetooth SoCs, the QN902x series, and the QN9020 Bluetooth development kit, by NXP Semiconductors, are available from Mouser Electronics. The integrated, ultra-low-power Bluetooth v4.0 Low Energy (BLE) SoCs can be used for Bluetooth Smart applications such as sports and fitness wearables, human interface devices, and app-enabled smart accessories. They integrate a high-performance 2.4GHz RF transceiver with a 32bit ARM Cortex-M0 microcontroller, 128kbytes of flash memory, and 64kbytes of system memory. In addition to the BLE radio and microcontroller, the SoCs incorporate the BLE protocol stack and profile software on a single chip.
Wearable
Bluetooth Smart sensor development kit targets virtual reality
Targeting IoT and virtual reality (VR) applications, what is claimed to be the world’s lowest power wireless smart sensor development kit has been released by Dialog. It comprises the company’s DA14583 SmartBond Bluetooth Smart SoC, combined with Bosch Sensortec’s gyroscope, accelerometer, magnetometer, and environmental sensors on a small PCB that measures just 16 x 15mm.
Audio jack detector and analogue switch are used in portable applications
Offering a space-saving alternative to miniQFN10 and WCSP devices, the Vishay Siliconix DG2592 audio jack detector and DG2750, low voltage, dual SPDT analogue switch have a slim profile of just 0.35mm and measure 1.4 x 1.8mm. Typical miniQFN10 and WCSP packages feature profiles of 0.55 mm. The thin miniQFN10 package of both devices is 36% thinner, allowing for slimmer handheld healthcare instruments, smartphones, tablets, portable media players, digital cameras, and wearable IoT devices. Compared to WCSP packages, the package is claimed to offer easier surface mounting and is better suited for the flexible PCBs commonly used in portable designs.
Automotive SoCs implement 3D graphics clusters
The first member of SoC in the R-Car family have been announced by Renesas. They can be used in 3D instrument cluster systems and provide a migration path as more automotive systems are expected to shift to 3D graphics instrument cluster systems in the near future.
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