Novocomms has unveiled NovoSat, a new lightweight dual port product with high performance GNSS capability and offering the full L Band frequency band for other devices.
Digiseq and Infineon launch world-first pre-certified ring inlay
Digiseq has received Mastercard certification for a world-first pre-certified concentric ring inlay, opening up the market for small independents and large brands to quickly and effectively launch payment rings within their collections. The inclusion of the ring inlay with integrated secured NFC chip can deliver multiple services, opening new use cases in addition to payments, such as loyalty, access, events and hospitality for consumers’ everyday life.
Noise suppression filters support wide frequency bandpass for audio quality
Support for wide frequency bandpass, extending from the FM band to the cellular band, makes the MAF1005FR compact noise suppression filters particularly well-suited for devices where high sound quality is crucial. TDK explained this is because they control sound distortions with only minimal reductions in volume, thanks to their low resistance.
They exhibit impedance of up to 2600 Ohm at 900MHz and insertion loss of more than 25dB. They also have a wide operating temperature range of -55 to +125 degrees C.
The MAF1005FR compact noise suppression filters measure 1.0 x 0.5 x 0.5mm. These multi-layer chip components are designed to improve sound quality and reduce noise interference in the audio lines (sound lines) of smartphones and other devices such as tablets, wearables, and portable games.
The audio lines in smartphones and similar devices emit electromagnetic noise, which can interfere with built-in antennas and degrade reception quality. This noise can be problematic, especially when high-quality audio and effective noise suppression are required. Chip beads are commonly used to control noise in audio lines. Although they effectively reduce noise, they can also distort the audio quality, impacting the sound in these lines, pointed out TDK.
The new MAF1005FR series of noise suppression filters can improve sound quality and reduce noise interference, with a typical impedance of up to 2600 Ohm at 900MHz and insertion loss of more than 25dB. This is achieved by newly developed low-distortion ferrite materials. As a result, the sound quality is maintained, and the issue of sound deterioration caused by chip beads is addressed.
The filters have a wide frequency bandpass, extending from the FM band to the cellular band. Unlike conventional products, which require two noise suppression filters for each frequency range, only one MAF1005FR component is required. This simplifies the design and implementation of noise suppression in electronic devices. The noise suppression filters support an operating temperature range of -55 to +125 degrees C.
TDK plans to expand its product lineup to include smaller components for high frequency bandpass noise control, ranging from 900MHz to 5GHz.
The filters are in mass production now.
TDK was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. TDK‘s comprehensive portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency and piezo and protection devices.
The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors. In addition, TDK provides power supplies and energy devices and magnetic heads marketed under the product brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda.
TDK has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.
ITEC claims latest RFID inlay die bonder is fastest and most accurate yet
According to ITEC, its ADAT3 XF Tagliner is the industry’s fastest and most accurate RFID inlay die bonder. It has placement speeds of up to 48,000 units per hour (UPH), with positional and rotational accuracies better than nine microns and 0.67 degrees at one sigma. It is three times faster and 30 per cent more accurate than other die bonding equipment, claimed the company. “
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