The compact AONDenoise stack technology enables customisable noise cancellation in low power, real time processing devices.
Wearable
Dual-core Bluetooth 5.2 module offers “next level connectivity”
With a feature set that belies its small size, the ISP2053 dual-core Bluetooth 5.2 module from Insight SiP is now available from Rutronik. The module measures 8.0 x 8.0 x 1.0mm and is based on the nRF5340 chip from Nordic Semiconductor and features powerful dual-core Cortex-M33 CPUs, with flash and RAM.
MEMS microphones have wide frequency range and high sensitivity
Three MEMS microphones by CUI Devices’ Audio Group have wide frequency ranges from 20 to 20,000Hz. The CMM-2718AB-38162W-TR, CMM-2718AB-38164W-TR and CMM-2718AT-38164W-TR are all analogue MEMS microphones featuring -38dB sensitivity ratings and tight sensitivity tolerances of ±1dB.
Integrated, low power, single-chip LCOS panel fits into AR/XR/MR glasses
The OP03011 liquid crystal on silicon (LCoS) panel integrates the array and frame buffer into an ultra-compact single-chip solution that is lightweight and low-power for smart glasses
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