Offering reduced assembly costs and increased reliability, Nexperia has developed a four-pin X2SON4 package. It is claimed to be the smallest logic package that can be used without requiring an expensive and fragile step-down mask. As a result, PCB assembly is quicker, easier, more reliable and more cost-effective, says Nexperia.
Weartech-Components & Hardware
Plessey partners with Vuzix to develop next-generation AR smart glasses
Plessey Semiconductors is linking with Vuzix to develop the necessary technologies for a new generation of AR smart glasses, based on the combination of Plessey’s microLED light source product family, Quanta-Brite and Vuzix expertise and IP in smart glasses and essential optic technologies.
High speed PIN photodiode slim down sensor designs for wearables
Broadening its optoelectronics portfolio, Vishay Intertechnology has the VEMD8080, a high speed silicon PIN photo diode with enhanced sensitivity for visible light.
Package enhances mechanical flexibility for crystal oscillator
Advanced package geometry enhances mechanical flexibility in the low power, low voltage quartz crystal available from Micro Crystal.
About Weartech
This news story is brought to you by weartechdesign.com, the specialist site dedicated to delivering information about what’s new in the wearable electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: weartechdesign.com
