Ceva has launched Ceva-Waves Links, a new family of multi-protocol wireless platform IPs. The integrated offering supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets. These IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread / Zigbee / Matter), to offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimised co-existence schemes and adapted to various radios and configurations.
Wearable
u-blox incorporates newest Nordic Semiconductor Bluetooth chips in two new compact modules
u-blox has announced two additions to its Bluetooth LE portfolio, ALMA-B1 and NORA-B2. The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor. They both support Bluetooth LE 5.4 and Thread/Matter technologies in a compact, power-efficient, and secure format.
ST boosts sensing creativity with new all-in-one MEMS Studio desktop software solution
ST’ MEMS Studio is a new all-in-one tool for MEMS sensor evaluation and development, connected closely with the STM32 microcontroller ecosystem and available for Windows, MacOS, and Linux operating systems.
Integrated LQ050XX load switch ICs from Littelfuse now at Rutronik
Equipped with state-of-the-art technology, Littelfuse’s LQ050XX integrated load switch ICs offer the industry’s highest performance with ultra-low power consumption. They make it possible to reduce parasitic leakage currents, improve system efficiency, and extend battery life. That means a real upgrade for a wide range of applications, e.g. in wearables, smart homes, or IoT devices.
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