Integrated, low power, single-chip LCOS panel fits into AR/XR/MR glasses

The OP03011 liquid crystal on silicon (LCoS) panel integrates the array and frame buffer into an ultra-compact single-chip solution that is lightweight and low-power for smart glasses

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Synopsys and Arm push on with next-gen mobile SoC designs

Synopsys combines EDA and IP with Arm’s Total Compute Solutions at Computex Taipei. The AI-enhanced design collaboration tackles mobile chip designs on advanced nodes down to 2nm. At the show, Synopsys announced full-stack AI-driven EDA suite, Synopsys Interface and Security IP and Synopsys Silicon Lifecycle Management PVT IP have been optimised for the highest levels of performance and power for Arm’s latest compute platform

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HD image sensor enables AI face recognition in thin bezel computers

The OV02E 1080p high definition (HD) image sensor has staggered high dynamic range (HDR) and can operate with AI chips to bring always-on ID recognition to notebooks and tablets with thin bezels. The 1/7.3 inch format sensor can be combined with the AI devices to sense human presence in always on, low power mode, to extend the battery life in thse portable devices.

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Nanusens shrinks sensor and control circuit for ASICs with embedded sensors

By simultaneously shrinking the sensor and control circuit, Nanusens has created a digital circuit design to measure the capacitance of its nanosensors to create ASICs with integrated sensors. Both the sensor structure and its detection circuitry can be made at the same time within a chip using standard CMOS processes on whatever process node is required, explained the company. As a result, ASICs can now be made with several sensors embedded within them. Integrating sensors as IP blocks offers dramatic reductions in costs and size, claimed Nanusens, as it completely replaces the current solution of discrete sensor packages.

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