3D-MID (mechatronic integrated devices, also known as 3D-circuits) technology integrates circuits directly into three-dimensional thermoplastic substrates, said Harting. This can shrink the circuitry and end product, for example, the housing of a hearing aid can be used to support the circuitry, replacing a separate circuit board.
Wearable
ESD clamping diodes are optimised for wearable devices
The TESD series of bi-directional proprietary clamping diodes are available from Taiwan Semiconductor in small DFN0603 packages. They provide ESD protection up to ±30kV.
Embeddable database streamlines and analyses MCU data in milliseconds
Real-time secure embedded data management software provider, ITTIA, has launched its latest database, ITTIA DB IoT 8.8 for microcontrollers, microprocessors and electronic control units. The databased streams, analyses and gains insight in real time to microcontroller data in milliseconds to advance edge computing for IoT devices, said the company.
Infineon goes beyond standard Wi-Fi with lates AIROC device
The latest addition to Infineon Technologies’ AIROC portfolio is the Airoc CYW5551x. This single device combines Wi-Fi 6 / 6E performance and advanced Bluetooth connectivity, making it suitable for a host of IoT applications.
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