Integrating connectivity and LTE modem in a single chip, Samsung believe that the Exynos 7 Dual 7270 is the first mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology. It claims that it is also the first in its class to feature full connectivity and LTE modem integration.
ICs & Semiconductors
High-speed rail-to-rail comparator saves space
Contained in a footprint that is less than 1.0mm2, the TS985 comparator combines battery-friendly micropower performance with enhanced dynamic range and high speed, claims STMicroelectronics.
Low-power microcontrollers accelerate prototyping for sensor hubs
Small, low power microcontrollers (MCUs) in the RL78/G11 group will enable users to easily and more quickly prototype and develop systems that support low-power sensor hubs and sensor application systems, says Renesas Electronics. Sensor hubs are designed to connect to multiple sensors and convert the sensor output signals to digital data, and are used in computer operating environment monitoring for data centre thermocouples in the industrial area, wearable health management devices in the healthcare field, and environmental sensing in greenhouses and factory farms in the agricultural industry.
Contactless wireless charging brings convenience to wearables
To charge low power applications, such as hearing aids and other wearable devices that require resistance to water and dust, Renesas has developed the RAA457100 power receiver IC and a power transmitter IC (the RAA458100). Each includes all the functions needed for wireless charging on a single chip. An evaluation kit is also available.
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