Renesas brings USB-C support to new ultra-low-power MCU Group

Renesas has introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a 48-MHz Arm Cortex M23 processor, the new MCUs offer a rich feature set that makes them ideal for portable devices and PC peripherals such as gaming mice and keyboards.

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ST announces mass production for turnkey Bluetooth/Wi-Fi modules developed with Qualcomm

STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity.

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Rohm develops new compact surface-mount near-infrared LEDs

Rohm has expanded its portfolio of surface-mount near-infrared (NIR) LEDs with new compact top-view types. They are optimised for applications such as VR/AR devices, industrial optical sensors, and human detection sensors.

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ST combines activity tracking and high-impact sensing in miniature AI-enabled sensor

ST has revealed an inertial measurement unit that combines sensors tuned for activity tracking and high-g impact measurement in a single, space-saving package. Devices equipped with this module can allow applications to fully reconstruct any event with high accuracy and so provide more features and superior user experiences. Now that it’s here, markets can expect powerful new capabilities to emerge in mobiles, wearables, and consumer medical products, as well as equipment for smart homes, smart industry, and smart driving.

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