Alliance Memory expands eMMC offering to simplify designs and save space

Alliance Memory has introduced 32, 64 and 128Gbyte industrial grade, embedded multimedia cards (eMMCs) for solid state storage in consumer, industrial, and networking applications.

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STM32H5 discovery kit builds a case for secure, smart, connected devices

Support for Secure Manager, a turnkey SoC which integrates core security services certified and maintained by ST is included in the STM32H5 discovery kit by STMicroelectronics.
The development board is for creating diverse applications with the company’s STM32H5 microcontrollers. The STM32H5 devices are intended for high performance processing and advanced security in a wide range of applications, including smart sensors, smart appliances, industrial controllers, networking equipment, personal electronics and medical devices. 

The STM32H573I-DK discovery kit enables developers to explore all the integrated features of the STM32H5, such as analogue peripherals, timers, the ST ART (Adaptive Real-Time) accelerator, media interfaces and mathematical accelerators. This makes it easy to evaluate new designs for industrial programmable logic controllers (PLC), motor drives, and smart controllers for appliances, for example, air conditioners, refrigerators and washing machines. Other potential applications include alarm controllers, communication hubs and smart lighting controls.
The STM32H573I-DK Discovery kit is a development board that includes an STM32H5 microcontroller, colour touch display, digital microphone, and interfaces such as USB, Ethernet, and Wi-Fi. The board also features an audio codec, flash memory, and headers for connecting expansion shields and daughterboards.
To simplify the development process, the STM32CubeH5 microcontroller software package consolidates all the necessary components required to develop an application on the STM32H5, including examples and application code. The package is fully integrated into the STM32Cube ecosystem, which contains additional software to assist with application development. ST also offers the STM32CubeMX tool for configuring and initialising the microcontroller.
The STM32H5 microcontroller features the Arm Cortex-M33 embedded microcontroller core running at 250MHz and is the first microcontroller to support ST’s Secure Manager SoC security solutions. The microcontrollers combine Arm TrustZone security with ST’s STM32Trust framework to provide trusted storage, cryptography, attestation and updates. They embed side-channel protected hardware cryptographic accelerators and target recognised security certifications, PSA Certified Level 3 and GlobalPlatform SESIP3.
ST has created the STM32H573I-DK Discovery kit with examples showing how to use the security services and integrated all the necessary software tools and support in the STM32Cube development ecosystem.
The Discovery kit as well as the H5 Nucleo Board Nucleo-H563ZI are available now available from ST’s eStore and authorised distributors.

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Sports sensor kit connects new and legacy fitness equipment

North Pole Engineering’s WYÛR and CÔRD sports sensor connectivity kits allow users to connect new and legacy fitness equipment that operate using different wireless protocols.

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MRigidCSP package is claimed to increase MOSFET’s mechanical strength  

Robust package technology, MRigidCSP, by Alpha and Omega Semiconductor (AOS), is initially offered on its AOCR33105E, 12V, common drain, dual N-channel MOSFET. The packaging technology is designed to decrease on resistance while increasing mechanical strength, and is particularly suited to battery applications in smartphones, tablets and ultra-thin notebooks.
AOS explained that fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices. As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications.  A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength. This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application. The AOCR33105E is designed with trench-power MOSFET technology in a common drain configuration for design simplicity. It features low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.
“Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness,” said Peter H. Wilson, senior MOSFET product line marketing director at AOS.
AOS designed the MRigidCSP package technology to be used with high aspect ratio CSP die sizes. The CSP construction delivers “a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process,” added Wilson.
The AOCR33105E is available in a 2.08 x 1.45mm package, with RDS(on) of 3mOhm at 4.5V / 4.2mOhm at 3.1V.
The AOCR33105E in the MRigidCSP package is immediately available in production quantities with a lead time of 14 to 16 weeks. It is RoHS 2.0 compliant and is halogen-free.

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