Able to support high-speed signal transmission applications (such as SATA or SAS), where flexible, expandable packaging for high-signal frequencies demands tight impedance control and 12Gbit/s data rates and above.
The ResilientFlex coiled assembly enables hot-swapping connections in removable-media applications, such as hot-swapping within storage drawers. The Molex assembly can be implemented in self-coiling flex circuit assembly or mechanically assisted coiling features that can extend electrical-connection lengths up to 558.80mm beyond the installed length.
Wearable
Sensor technology allows gloved touch tracking
Single layer, multi-touch sensors are now supported by the TrueTouch Gen4X touchscreen controller family from Cypress. It leverages the company’s Single-Layer Independent Multi-touch (SLIM) sensor structures. The controller also adds support for the company’s tracking of multiple fingers in gloves.
Proprietary process miniaturises electronic components
Designed to meet the needs of high-performance mobile and wearable products, RASMIDs (Rohm Advanced Smart Micro Devices) are based on proprietary packaging and manufacturing technologies.
Architecture is low power for connectivity IP in IoT and wearable devices
Ensigma Series4 ‘Whisper’ low-power radio processing unit (RPU) architecture is designed to drive a new generation of wearables, IoT and other connected devices where ultra-low power consumption and low cost points are key, says Imagination Technologies.
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