With Industry 4.0, the rapid rise of Artificial Intelligence (AI), digitised manufacturing and the age of IoT everything, the demand for wireless connectivity in commercial and industrial applications is growing at an exceptional pace. These applications typically require reliable connectivity that can withstand extreme environments that are exposed to high temperatures, background noise and obstructions. To help meet this need, Microchip Technology has added 20 products to its Wi-Fi® portfolio.
Weartech-Comms / Bluetooth / Wireless
Insight SiP launches next generation bluetooth radio in miniature integrated SiP package
Insight SiP is launching the ISP2454-MX module in a tiny package measuring 8 x 8 x 1mm, the smallest package on the market. With extended temperature capability up to 105oC, this device can support next generation Bluetooth based solutions including Angle of Arrival and the new Bluetooth Channel Sounding technology. Based on the new Nordic nRF54L15, this offers improved performance across the board, being based on a 4th generation radio and a double speed microprocessor compared with the nRF52 series-based devices, at a lower cost.
Infineon expands its Bluetooth portfolio with eight new parts
Infineon has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimised for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.
Ceva Bluetooth low energy IPs bring ultra-low power wireless connectivity
Ceva has announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers.
The Balletto family is a complete Edge AI/ML microcontroller solution for connected IoT platforms with integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem and a dedicated network co-processor, enabling connectivity and machine learning in a single chip. The Balletto family delivers up to 50x boost in machine learning performance and inference efficiency versus traditional MCUs that lack neural co-processors. The Ceva-Waves Bluetooth Low Energy IP provides Balletto MCUs with the robust connectivity at ultra-low power consumption, and supports Bluetooth LE Audio and Auracast broadcast audio, for customers who wish to leverage Balletto to create highly differentiated wireless audio products. The Balletto family also relies on Ceva-Waves 802.15.4 IP for Thread, Zigbee and Matter support in smart home applications.
About Weartech
This news story is brought to you by weartechdesign.com, the specialist site dedicated to delivering information about what’s new in the wearable electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: weartechdesign.com
