With a feature set that belies its small size, the ISP2053 dual-core Bluetooth 5.2 module from Insight SiP is now available from Rutronik. The module measures 8.0 x 8.0 x 1.0mm and is based on the nRF5340 chip from Nordic Semiconductor and features powerful dual-core Cortex-M33 CPUs, with flash and RAM.
Weartech-Comms / Bluetooth / Wireless
Integrated, low power, single-chip LCOS panel fits into AR/XR/MR glasses
The OP03011 liquid crystal on silicon (LCoS) panel integrates the array and frame buffer into an ultra-compact single-chip solution that is lightweight and low-power for smart glasses
Battery-operated video camera systems add AI for cloud IoT devices
InnoPhase IoT adds AI and solar panel augmentation to battery-operated video camera system via the Talaria TWO ULP (ultra low power) Wi-fi-optimised reference kit for cloud-connected IP video IoT devices.
Chipset for 5G mobile devices is latest member of Semtech PerSe family
Semtech has expanded its PerSe product portfolio with the PerSe Connect SX9376 IC which is purpose built for 5G mobile devices.
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