Bluetooth Low Energy (LE) Audio has been available for several years now, based on the Bluetooth 5.2 release, with the full specifications completed in 2022. It takes time, however, for specifications to yield working devices, and in the case of LE Audio, to have true value, you need an ecosystem of compatible “other ends” – headphones, speakers, smartphone support and so on. This takes time, and so it is only now that use of LE Audio is becoming prevalent in audio solutions.
Weartech-Comms / Bluetooth / Wireless
Wireless modules for embedded systems now available from Tria Technologies
Tria Technologies, an Avnet company has announced the availability of two new wireless modules, the SPB611 and SPB209. These modules support multiple short-range protocols and help speed the development of wireless-enabled embedded systems.
NXP’s new i.MX 93W fuses edge compute and secure wireless connectivity
NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
Nordic Semi debuts low-power nRF93M1 Cat 1 bis module at MWC 2026
Nordic Semiconductor is demoing the nRF93M1 module with LTE Cat 1 bis connectivity and its associated development kit at MWC 2026. This will be part of Nordic’s suite of additions to its future-ready cellular IoT portfolio.
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