NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
Weartech-Comms / Bluetooth / Wireless
Nordic Semi debuts low-power nRF93M1 Cat 1 bis module at MWC 2026
Nordic Semiconductor is demoing the nRF93M1 module with LTE Cat 1 bis connectivity and its associated development kit at MWC 2026. This will be part of Nordic’s suite of additions to its future-ready cellular IoT portfolio.
Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimised for IoT
To support continued growth of connected devices in home, industrial and commercial markets, Infineon has introduced the AIROC ACW741x, a new product family that integrates a tri-radio with Wi-Fi 7, Bluetooth LE 6.0 with Channel Sounding, and IEEE 802.15.4 Thread, with Matter ecosystem support in a single device. This product family introduces the industry’s first 20 MHz Wi-Fi 7 device for IoT, provides Wi-Fi 7 Multi-Link for IoT for enhanced robustness in congested environments and has the industry’s lowest Wi-Fi connected standby power.
Taoglas expands compact chip antenna range for Wi-Fi 6/7, UWB and ISM applications
Taoglas has announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimised for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 are designed for next-generation IoT, consumer, industrial, and wearable applications.
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