A low current consumption model has been added to the HSPPAD series of digital pressure sensors for integration into smartphones, tablets and wearable devices. The HSPPAD042A has been developed in response to the need smartphones, tablets and wearable electronics using different kinds of software and applications which demand higher performance while increasing the power requirement. Sensors need to be not only power-efficient but also more compact given the higher number of parts integrated, says the company.
Wearable
Bluetooth Low Energy module claims to be world’s lowest power
Claimed to increase battery life by up to three times longer than other solutions on the market today, the low power Atmel SmartConnect XR and ZR modules consume less than 4mA in RX and less than 3mA in TX with 3.6V, and below 1.2µA in sleep mode.
Magnetic sensor reduces power consumption and processing time
Designed for portable devices, the MMC3630KJ, is a small, BGA package, magnetometer, from Memsic. The magnetometer integrates a monolithic, three-axis AMR sensor and signal conditioning ASIC and is based on the company’s proprietary technology. The BGA package measures 1.2 x 1.2 x 0.5mm. It has a range of ±30G range, and more than five times better noise level compared to other technologies, says the company. With 600Hz magnetic sensing bandwidth, the magnetometer provides better than 10 accuracy in eCompass applications. The design also has drastically lower system level power consumption and processing time, claims the company. There is also a self-degaussing feature, which can eliminate the output drift due to temperature change and residual magnetic from ambient magnetic field. The series also includes an interruption feature, which can be used for motion detection and data acquisition ready notifications to lower system-level power consumption. http://www.memsic.com
NFC security module protects wearable devices
Fitness trackers and smart keys to chains, watches or wristbands are increasingly including mobile payment functionality, needing them to be equipped with security and NFC technologies. Infineon has launched an NFC security module series in collaboration with Beijing-based Mobile Payment Solutions (MPS). It is claimed to “significantly” reduce design efforts by bundling an Infineon security chip with NFC antenna components and software on a small PCB footprint. The smallest module of the series measures only 4.0 x 4.0mm.
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