An RF module with dual-core processor uses Bluetooth technology in what is claimed to be the smallest package on the market. Insight SiP says the ISP2053-AX RF module supports sophisticated applications and removes the need for an additional host processor.
Sector News
TDK offers miniaturised, highly sensitive MEMS pressure sensor element
Designed to measure a range of 0 to 100 mbar, TDK Corporation’s C35 type pressure sensor element combines high sensitivity with low dimensions of 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.
Intel expands neuromorphic research chip – introducing Loihi 2
Now with one million neurons, the second generation research chip from Intel, Loihi 2, uses a pre-production Intel 4 process. There is also now a software framework for developing neuro-inspired applications.
Wireless charging transmitter coil driver is in QFN3x3 package
The first in a family of coil drivers from Alpha and Omega Semiconductor (AOS) that are supplied in a thermally enhanced QFN3x3 package are suitable for wireless charging transmitter circuits in a variety of space constrained applications.
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