Toshiba introduces new series of 300mA LDO voltage regulators

Toshiba has announced the introduction of the TCR3DMxxA and TCR3EMxxA series of general-purpose, single-output voltage regulators with an on/off control input, featuring a low dropout voltage and fast transient response. Both series are housed in the ultra-small DFN4D package (1.0mm x 1.0mm x 0.37mm), which enables the use of small ceramic input and output capacitors (≥1.0µF). This makes them suitable for industrial applications or battery-powered systems requiring high-density board assembly. Moreover, the devices provide a control pin threshold voltage (VCTH) of 0.8V (min) and support 1.2V I/Os, helping to extend the device’s battery life.

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New Bluetooth module from Panasonic Industry

The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5 MB and a RAM size of 256 kB.
An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.

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u-blox expands its NORA-B2 Bluetooth LE modules series to address all mass market segments

u-blox has expanded its portfolio by introducing six new variants of the NORA-B2 Bluetooth Low Energy modules. Now integrating the entire range of Nordic Semiconductor’s next-level nRF54L Series of ultra-low power wireless Systems-on-Chip (SoCs), NORA-B2 offers a versatile solution for mass market segments thanks to its choices of antennas, architectures and chipsets.

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Infineon’s Wi-Fi 6/6E and Bluetooth Kit now at Mouser

Mouser is now stocking the CYW9RPIWIFIBT-EVK Wi-Fi 6/6E and Bluetooth kit from Infineon Technologies. The CYW9RPIWIFIBT-EVK evaluation kit, powered by a Raspberry Pi Compute Module 4 Lite (CM4), is a versatile development tool for advanced wireless applications. With the CYW9RPIWIFIBT-EVK kit, developers can evaluate, prototype, and develop a variety of Wi-Fi and Bluetooth applications.

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