Available in a wafer level chip scale package (WLCSP), optimised for compact, two-layer PCB wireless products, the nRF52805 SoC adds Bluetooth 5.2 to Nordic Semiconductor’s nRF52 series.
Sector News
TDK claims T3902 is world’s lowest power PDM microphone
Designed for use in mobile devices, wearables, headsets and TV remotes, the InvenSense T3902 digital microphone is supplied in a 3.5 x 2.65 x 0.98mm package.
Winbond introduces HyperRAM WLCSP to reduce form factor
Claimed to offer an unprecedented thin form factor in embedded application, the HyperRAM WLCSP is particularly suitable for wearable devices, says Winbond.
Wearables can protect with social distancing and contact tracing
A reference design from ST Microelectronics uses a Bluetooth Low Energy SoC, a MEMS accelerometer and a sub-GHz RF transceiver in a scalable environment for wearable devices that can implement social distancing and contact tracing.
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