The nRF9151 from Nordic Semiconductor is a new addition to the Rutronik Wireless portfolio: an energy-efficient system-in-package (SiP) with integrated LTE-M, NB-IoT, GNSS, and DECT NR+ radio modem. Currently the smallest and most power-efficient device of its kind, the nRF9151 sets a new standard for highly integrated and compact SiP solutions. Also available is the nRF9151 DK, a specially developed, cost-effective and pre-certified single-board development kit for initial evaluation and development purposes. As a fully integrated, pre-certified SiP with an application MCU, the nRF9151 is suitable for the development of extensive applications or for use as a stand-alone cellular modem. This simplifies the development and deployment of scalable products in numerous IoT markets, including industrial automation, asset tracking, smart city, smart metering and smart agriculture.
The nRF9151 represents a significant advance in cellular IoT technology and offers a cost-effective and globally accessible solution. The comprehensive and compact solution includes hardware with a programmable application processor, software, cloud services, development tools and world-class support.
ICs & Semiconductors
u-blox empowers global connectivity with new ultra-compact LTE Cat 1bis cellular modules
u-blox has announced an expansion to its popular range of R10 products for the fast-growing LTE Cat 1bis cellular connectivity market. Predicted by analyst firm Techno Systems Research Co., Ltd to account for 43.6% of all non-handset cellular devices by 2029, LTE Cat 1bis is expected to be the best-selling cellular technology for the Internet of Things (IoT) for the next four to five years. The new modules strengthen u-blox’s LTE Cat 1bis portfolio, serving both the IoT and users migrating from legacy 2G/3G cellular connectivity.
The new u-blox LEXI-R10 Global provides an ultra-compact 16 x16mm LTE Cat 1bis solution that can be used worldwide in size-constrained IoT applications such as people or pet trackers and wearables. The LEXI-R10 Global is the world’s smallest single-mode LTE Cat 1bis module with indoor location and a US MNO certified core.
Meanwhile, the new SARA-R10 series brings the same capabilities as the LEXI-R10 Global to u-blox’s popular SARA form factor. With 2G and 3G sunsets continuing globally, the SARA-R10 offers product designers using 2G and 3G u-blox SARA modules a straightforward upgrade path to 4G LTE – the most widely available global cellular standard today and for many years to come.
The LEXI-R10 and SARA-R10 offer the option to embed an eSIM, and both modules also include an integrated Wi-Fi Sniffer, providing Indoor localisation via the u-blox CellLocate service based on both a Wi-Fi and cellular networks.
One of the variants is the SARA-R10M10, the world’s smallest LTE Cat 1bis module with embedded Global Navigation Satellite System (GNSS) capable of concurrent communication and tracking. It is the ideal solution for asset tracking and telematics applications that demand continuous connectivity as well as indoor and outdoor positioning anywhere in the world, thanks to the blend of GNSS, Wi-Fi scan and global LTE coverage. This module is also 50% smaller than u-blox’s previous LTE Cat 1bis combo, the LENA-R8M10.
The new u-blox R10 modules give product designers a 4G cellular connectivity solution for IoT applications that require medium data rates, worldwide portability, ultra-low power consumption and compact sizes.
Taiwan Semi’s new ESD protection devices are optimised for high-density electronics
Taiwan Semiconductor has introduced a new series of new ultra-small ESD protection devices optimised for wearables and other high-density electronic products. All DFN0603-packaged models in the 3.3V and 5.0V TESDx Series exceed the 8kV IEC61000-4-2 20kV contact discharge standard as well as IEC6100-4-5 4A peak pulse current, with margin. TESDx Series devices utilise Taiwan Semiconductor’s proprietary clamping cells to prevent overvoltage damage from ESD and lightning on control, power and data lines. Additionally, their industry’s lowest capacitance allows for full USB 3.0 data rates without compromise.
Infineon expands its Bluetooth portfolio with eight new parts
Infineon has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimised for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.
About Weartech
This news story is brought to you by weartechdesign.com, the specialist site dedicated to delivering information about what’s new in the wearable electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: weartechdesign.com
