Wireless communications company Rayson Technology has released a multiprotocol module based on Nordic Semiconductor’s nRF5340 System-on-Chip (SoC). The SoC is designed for advanced Bluetooth LE audio applications, as well as sophisticated metering, wearable, smart home, industrial, and medical use cases. Measuring just 16.5 by 13.0 by 2.5 mm, the ‘BTM-N340X’ module supports LE Audio and its Low Complexity Communication Codec (LC3), which together enable higher quality, lower power wireless audio streaming compared with existing Classic Bluetooth audio solutions.
ICs & Semiconductors
ST reveals a new global-shutter image sensor that offers high resolution and low power consumption
ST is enhancing smart computer vision with its latest global-shutter image sensor. The global-shutter sensor technology is particularly useful for capturing distortion-free images when the scene is moving or when near-infrared illumination is used.
Digiseq and Infineon launch world-first pre-certified ring inlay
Digiseq has received Mastercard certification for a world-first pre-certified concentric ring inlay, opening up the market for small independents and large brands to quickly and effectively launch payment rings within their collections. The inclusion of the ring inlay with integrated secured NFC chip can deliver multiple services, opening new use cases in addition to payments, such as loyalty, access, events and hospitality for consumers’ everyday life.
ITEC claims latest RFID inlay die bonder is fastest and most accurate yet
According to ITEC, its ADAT3 XF Tagliner is the industry’s fastest and most accurate RFID inlay die bonder. It has placement speeds of up to 48,000 units per hour (UPH), with positional and rotational accuracies better than nine microns and 0.67 degrees at one sigma. It is three times faster and 30 per cent more accurate than other die bonding equipment, claimed the company. “
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