Infineon has announced the CYW20822-P4TAI040, its latest Bluetooth module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics. This module offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high performance, Infineon’s CYW20822-P4TAI040 is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart home, asset tracking, beacons and sensors, and medical devices.
ICs & Semiconductors
u-blox introduces new LTE-M modules with integrated GNSS to boost industrial connectivity
u-blox has announced two new LTE-M cellular module series, the SARA-R52 and LEXI-R52. These modules, designed for industrial applications, are based on the u-blox UBX-R52 cellular chip and are tailored for integrated and concurrent positioning and wireless communication needs. Typical IoT use cases include fixed and mobile applications such as metering and utility, asset tracking and monitoring, as well as healthcare.
HaiLa showcases first Wi-Fi-based extreme-low-power backscatter chip
HaiLa Technologies has announced the availability of the BSC2000 RF evaluation chip development and demonstration kits. Presto Engineering successfully collaborated with HaiLa to develop the first complete analog and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.
New LCD bias power ICs from Nexperia extends battery life and video display lifetime
Nexperia have introduced a new series of space-saving, high-efficiency, dual-output LCD bias power supplies. These devices have been designed to extend the lifetime of thin film transistor liquid crystal display (TFT-LCD) panels used in various applications including smartphones, tablets, virtual reality (VR) headsets, and LCD modules.
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