STMicroelectronics has introduced the LPS27DEWO, a high-accuracy MEMS pressure sensor that combines altitude and underwater depth monitoring in a single device. Designed for wearables, sports cameras and outdoor equipment, the sensor offers two selectable full-scale ranges in a compact package.
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MEMSensing launches bone-vibration sensor in Europe
MEMSensing has announced the European launch of its microelectromechanical systems (MEMS) bone-vibration sensor developed to improve uplink voice capture in true wireless stereo (TWS) earbuds. Used alongside a conventional microphone, the sensor provides a separate reference for the wearer’s voice that is less affected by background and wind noise. Its compact, low-power design and microphone-like voltage output support integration, while the capacitive MEMS architecture enables reliable vibration detection in a component suited to high-volume production.
Murata begins production of world’s smallest three-terminal low-ESL MLCCs
Murata has begun mass production of the LLD series, the world’s smallest* three-terminal low-equivalent series inductance (ESL) multilayer ceramic capacitors (MLCC). Measuring just 0201-inch size (0.6 × 0.3 mm), the new products reduce mounting area by approximately 64% compared with Murata’s previous smallest 0402-inch size (1.0 × 0.5 mm), freeing up valuable PCB space in compact devices such as smartphones and wearables.
Nordic Semi launches new multiprotocol SoC for size and cost effective devices
Nordic Semiconductor has unveiled the nRF54LC10A System-on-Chip (SoC), supporting Bluetooth Low Energy (LE), Bluetooth Channel Sounding, Thread, Zigbee, and Matter. Developers building small, cost-sensitive, connected products can now meet aggressive size and cost targets without sacrificing protocols, security features, or a comprehensive software ecosystem.
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