At next week’s Sensor+Test 2023 in Nuremberg, Germany(09 to 11 May), STMicroelectronics will release a toolchain and accompanying software package for programming the intelligent sensor processing unit (ISPU) embedded in the ISM330IS and LSM6DSO16IS intelligent MEMS IMUs (inertial measurement units).
ICs & Semiconductors
Rohm’s smallest SWIR devices are resilient to sunlight and smoke
Short wavelength infrared (SWIR) devices in the industry’s smallest class 1608 size package are in mass production at Rohm. The SWIR devices measure 1.6 x 0.8mm and are suitable for sensing applications portable, wearable or hearable devices which require material detection.
Chipset for 5G mobile devices is latest member of Semtech PerSe family
Semtech has expanded its PerSe product portfolio with the PerSe Connect SX9376 IC which is purpose built for 5G mobile devices.
Rutronik offers Wi-Fi 6 seamless connectivity with Nordic’s nRF7002
Nordic Semiconductor’s nRF7002 is a companion IC for integrating seamless Wi-Fi 6 connectivity into a range of applications. It is a cost-effective and power-saving option, said Rutronik, with high speed, improved range and the reliability of the latest Wi-Fi standard.
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