Rutronik expands its storage portfolio with KIOXIA e-MMCs for industrial and consumer applications

With KIOXIA’s e-MMC memory solutions, Rutronik offers compact and powerful embedded components based on the BiCS FLASHTM generation 5 TLC 3D flash memory. The e-MMCs are available in 64 GB (THGAMSG9T15BAIL_TRAY / THGAMSG9T15BAIL_REEL) and 128 GB (THGAMST0T25BAIL_TRAY / THGAMST0T25BAIL_REEL) and support the JEDEC e-MMC 5.1 protocol, operate with an I / O voltage of 1.8 V and achieve transfer rates of up to 340 MB / s (read) and 230 MB/s (write) in HS400 mode. The memory solutions are specified for a wide temperature range from -25 °C to +85 °C.

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Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimised for IoT

To support continued growth of connected devices in home, industrial and commercial markets, Infineon has introduced the AIROC ACW741x, a new product family that integrates a tri-radio with Wi-Fi 7, Bluetooth LE 6.0 with Channel Sounding, and IEEE 802.15.4 Thread, with Matter ecosystem support in a single device. This product family introduces the industry’s first 20 MHz Wi-Fi 7 device for IoT, provides Wi-Fi 7 Multi-Link for IoT for enhanced robustness in congested environments and has the industry’s lowest Wi-Fi connected standby power.

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Nordic Semiconductor simplifies edge AI for billions of IoT devices

Nordic Semiconductor is bringing AI intelligence and functionality to the smallest battery-powered IoT devices. With an ultra-low-power Edge AI solution, Nordic accelerates the arrival of a new generation of devices with integrated edge AI intelligence – combining energy efficiency with unmatched ease of use for developers.

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New ultra-compact wireless SoC from Nordic Semi for miniaturised applications

With the recently launched nRF54LV10A, Rutronik is expanding Nordic Semiconductor’s ultra-low-power wireless portfolio with a new, particularly energy-efficient system-on-chip (SoC) for miniaturised applications in the medical and wearable segment. The SoC combines an extremely compact chip-scale package with high computing power, advanced security features and a radio architecture that supports Bluetooth LE, proprietary 2.4 GHz protocols and Bluetooth channel sounding in low-voltage operation for the first time. Samples and development kits of the nRF54LV10A are available through an early access program.

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