Infineon expands CoolGaN family to deliver up to 82 percent footprint reduction

Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of modern smartphones, notebooks, and wearables, this is a significant and quantifiable step forward. Targeting compact consumer devices, the new devices give power system designers greater flexibility to optimise efficiency and streamline designs without sacrificing performance.

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ROHM launches an ultra-compact wireless power chipset for wearables

ROHM has developed a wireless power supply IC chipset consisting of the receiver – ML7670 – and transmitter – ML7671 – compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.

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ST announces new sensors for personal electronics and smart devices

ST has introduced a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries or harvested energy. The VD55G4 (monochrome) and VD65G4 (RGB colour) sensors, part of the ST BrightSense portfolio, are now available to early adopters, enabling customers to start designing their next generation of smart, ultralow-power vision devices today.

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u-blox introduces the F11 platform for ultra-low power meter-level GNSS

u-blox has announced the launch of the u-blox F11 platform. The new L1/L5 dual-band standard-precision GNSS platform is designed to improve positioning accuracy while reducing power consumption to as low as 7 mW in typical configurations using Low Energy Accurate Positioning (LEAP) mode for tracking and wearable applications.

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