Winbond introduces HyperRAM WLCSP to reduce form factor

Claimed to offer an unprecedented thin form factor in embedded application, the HyperRAM WLCSP is particularly suitable for wearable devices, says Winbond.

The HyperBus technology’s interface has a low pin count, compared with other memory types,  which makes the circuit board layout simpler and the wiring area relatively small, says the company. Several IC design service companies have launched HyperBus-related IP, which makes it easier for main chip manufacturers to design memory controllers.

Comparing to the existing 3.0V HyperRAM products operating at 100MHz / 200Mbits per second and 1.8V HyperRAM products operating at 166MHz / 333Mbits per second, the Winbond HyperRAM 2.0 products can operate at a maximum frequency of 200MHz and provide a maximum data transfer rate of 400Mbits per second with either 3.0V or 1.8V operation voltage.

There are four product lines to offer a choice of memory density: 32Mbit, 64Mbit, 128Mbit and 256Mbit, to meet a choice of applications.

Package options include 24-ball, 8.0 x 6.0mm TFBGA, for automotive and industrial applications; there is a 49-ball, 4.0 x 4.0mm WFBGA, for consumer applications, a 15-ball, 1.48 x 2.0mm wafer level chip scale package (WLCSP) and a known good die option.

The key advantages of the WLCSP are the minimum inductance of die to PCB, enhanced thermal conduction, reduced package size, weight and smaller footprint. These characteristics make WLCSP the typical choice for mobile products like cellular phones as well as wearable electronics, such as smart watches.

Winbond Electronics provides customer-driven memory products, backed by product design, R&D and manufacturing capabilities, together with sales services. Winbond’s product portfolio consists of specialty DRAM, mobile DRAM and code storage flash. Winbond memory products are used by tier-1 customers in communication, consumer electronics, automotive and industrial and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong.

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