TrueWireless SoCs use Mirroring for seamless ear bud role swapping

SoCs by Qualcomm use TrueWireless Mirroring technology in ear buds to support dynamic and seamless bud-to-bud role swapping with Bluetooth address handover even during run time. True Wireless Mirroring also supports balancing out power distribution between both ear buds, adds Qualcomm.

The QCC3056 SoCs have been designed to support the forthcoming LE Audio standard and new user experiences with end-to-end operability from smartphone to ear buds.

LE Audio is expected to allow users to share music on a smartphone with multiple Bluetooth speakers or headsets, letting others enjoy the same music, at the same time.

The SoCs are compatible with Bluetooth 5.2 radio and have a powerful quad-core processor architecture and a dual core 32-bit processor application subsystem (up to 80Mhz). There is also a dual core 120Mhz-configurable Qualcomm Kalimba DSP audio subsystem, which runs from ROM.

They are based on Qualcomm TrueWireless Mirroring technology for robust operation and are designed to support wake word and button activated digital assistants (e.g Amazon Alexa Voice Service and Google Assistant). There is support for Google Fast Pair and the software architecture is compatible with Qualcomm’s QCC302x and QCC304x series

Other features are embedded ROM and RAM and external Q-SPI flash memories, connectivity to external SRAM or second flash device.

The QCC3056 SoCs combine high-performance audio with low power consumption and Qualcomm aptX Adaptive audio provides consistent, high quality streaming over Bluetooth at up to 96Khz audio resolution. There is also Qualcomm aptX Voice for what the company describes as superior call quality on uplink and downlink. In addition, 8th generation Qualcomm cVc echo cancelling and noise suppression is coupled with support for Qualcomm active noise cancellation (ANC) feed forward, feedback and hybrid and Qualcomm Adaptive ANC.

They are Bluetooth 5.2-qualified, and operate at 2Mbits per second and 3Mbits per second.

The SoCs are supplied in a 94-pin WLCSP which measures 4.38 x 4.26 x 0.4mm.

(Picture: Qualcomm)

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