Third generation HyperRAM doubles bandwidth
Simplified design and double data transfer rate have been achieved with the third generation of HyperRAM, developed by Winbond Electronics and Infineon Technologies. The collaboration has produced the higher bandwidth HyperRAM 3.0.
HyperRAM offers compact alternatives to traditional pseudo-SRAM and is suited to low power, space-constrained IoT applications that require an off-chip external RAM. HyperRAM 3.0 operates at a maximum frequency of 200MHz with a 1.8V operation voltage, which is the same as both HyperRAM 2.0 and Octal xSPI RAM, but with an increased data-transfer rate of 800Mbytes per second. This is double the rate that was previously available. The latest generation HyperRAM operates via a 16-bit extended version of the I/O HyperBus interface, with 22 pins.
Low pin count, low power consumption and easy control are three key features of HyperRAM that help it significantly improve the performance of IoT end devices, says Winbond. HyperRAM simplifies the PCB layout design, extends mobile devices’ battery life and works with a smaller processer via a lower pin count while increasing throughput compared to low-power DRAM, SDRAM, and CRAM/PSRAM, adds the company.
Going beyond simple machine to machine (M2M) communication, new IoT devices perform voice control or tinyML inferences and therefore need a higher memory performance. The HyperRAM family is suitable for low-power IoT applications, such as wearables, instrument clusters in automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays and communication modules. HyperRAM 3.0 operates under the same command/address signal and similar data bus format as earlier generation HyperRAM but with enhanced bandwidth and the same standby power and with little pin change. The first member of the HYPERRAM 3.0 family will be a 256Mbit device in a KGD, WLCSP (wafer level chip scale package) which can be implemented at the component level, module level or PCB level based on the end product type.
Optimised HyperBus memory controllers are available from multiple third-party IP vendors.
The 256Mb HyperRAM 3.0 devices are sampling now.