Renesas adds two Arm Cortex-M33 core MCUs to 32-bit RA family

The RA4E2 and RA6E2 MCUs deliver up to 200MHz in compact packages and offer rich peripheral options for sensing, gaming, wearables and appliances, said Renesas.

They are both based on the Arm Cortex-M33 core with Arm TrustZone technology. The 100MHz RA4E2 Group and 200MHz RA6E2 Group of MCUs are optimised to provide power efficiency, said Renesas. They are available in 128kbyte and 256kbyte flash options and 40kbytes of SRAM. Connectivity options are on-chip CAN FD, USB, QSPI, SSI and I3C interfaces. The MCUs offer an upgrade path to other members of the RA family. 

The RA4E2 and the RA6E2 offer a cost-effective option with integrated CAN FD and space saving packages as small as a 4.0 x 4.0mm 36-pin BGA or a 5.0 x 5.0mm 32-pin QFN. 

All RA devices are supported by the Renesas flexible software package (FSP) that includes efficient drivers and middleware to ease the implementation of communications and improve functionality of peripherals. The FSP’s GUI simplifies and accelerates the development process, said Renesas. It enables flexible use of legacy code as well as compatibility and scalability with other RA family devices. Designers using FSP also have access to the full Arm ecosystem as well as Renesas’ extensive partner network, offering a wide range of tools that help speed time-to-market.

The RA4E2 Group includes five different options, spanning from 32-pin to 64-pin packages as small as 4.0 x 4.0mm, and 128kbyte of flash memory along with 40kbyte of SRAM. The devices use just 82 microA / MHz while executing from flash at 100MHz. They have an extended operating temperature range of -40 to +105 degrees C. 

The devices in the RA4E2 Group are based on a 100MHz Arm Cortex-M33 CPU core and can reduce system costs by virtue of the internal oscillator, general purpose I/O, advanced analogue, low voltage detection and internal reset function

The RA6E2 Group MCUs deliver 200MHz performance. Based on a 200MHz Arm Cortex-M33 CPU core, they also have low power operation ( 80 microA / MHz in active mode at 200MHz). The group includes 10 different parts, spanning from 32-pin to 64-pin packages as small as 4.0 x 4.0mm, and from 128kB to 256kbyte of flash memory along with 40kbyte of SRAM. Integrated communications options including USB 2.0 full-speed device, SCI, SPI, I3C, HDMI CEC, SSI, QSPI, and CAN FD and an integrated timer.

Renesas has designed a full Add-on Voice User Interface (VUI) using the RA6E2 MCU and other compatible devices from the Renesas portfolio. It can be added to devices such as smart thermostats or appliances. 

All RA4E2 and RA6E2 MCUs are available today with separate evaluation kits and fast prototyping boards available for both MCU groups.

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