Processor claims a first for 14nm FinFET wearable devices

Integrating connectivity and LTE modem in a single chip, Samsung believe that the Exynos 7 Dual 7270 is the first mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology. It claims that it is also the first in its class to feature full connectivity and LTE modem integration.

Designed on the company’s process technology, it offers power savings, 4G LTE modem and full connectivity, and packaging technology that is optimised for wearable devices. It is hoped that it will accelerate wider adoption of wearable devices by overcoming limitations such as energy usage and design flexibility.

The processor is powered by two Cortex-A53 cores, and delivers a 20 per cent improvement in power efficiency when compared to its predecessor built on 28nm. This also notably extends the battery life.

By integrating Cat.4 LTE 2CA modem, the AP allows wearables to connect to a cellular service as a standalone device. Tethering and data transfer between devices is also possible with its embedded WiFi and Bluetooth connectivity. In addition, integrated connectivity capabilities support FM radio, and location-based services with GNSS (global navigation satellite system).

The SiP (system-in-package)-ePoP (embedded package-on-package) provides a 100mm² area package size, integrating the AP, DRAM and NAND flash memory chips as well as the PMIC in a single package.

A reference platform comprised of the Exynos 7270, NFC and various sensors is currently available for device manufacturers and customers.

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