A multi-functional, compact charging IC for lithium-ion (Li-ion) batteries, the XC6810, supports wireless power transfer.
Wearable
Infineon and pmdtechnologies develop 3D depth-sensing technology for Magic Leap 2
Augmented reality (AR) applications are about to fundamentally change the way we live and work. Later this year, AR pioneer Magic Leap is expected to introduce its newest AR device, the Magic Leap 2. Designed specifically for enterprise use, Magic Leap 2 will be among the most immersive enterprise AR headsets in the market. With industry-leading optics and powerful computing in an ergonomic design, Magic Leap 2 will enable operators to work more efficiently, help companies optimise complex processes, and allow staff to seamlessly collaborate. One of the key features of Magic Leap 2 is the 3D indirect-Time-of-Flight (iToF) depth sensing technology that was co-developed by Infineon and pmdtechnologies.
Infineon combines Airoc Wi-Fi / Bluetooth in Nvidia Jetson for edge AI
Airoc Wi-Fi and Bluetooth connectivity provides Wi-Fi 6 / 6E and low power wi-Fi 5 connectivity to Nvidia’s Jetson system on modules (SoMs) for developers to accelerate artificial intelligence (AI) -enabled edge devices.
LTE-M and NB-IoT module
Industrial IoT, connected or smart agriculture, logistics and smart metering applications can use the Adrastea-I module by Würth Elektronik. The low power, multi-band LTE-M and NB-IoT module measures just 13.4 x 14.6 x 1.85mm but integrates GNSS, an Arm Cortex M4 and 1Mbyte flash memory which is reserved for user application development.
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