DSP-based system accelerates ‘smart’ device development

Claimed to accelerate the deployment of ‘smart and connected’ devices, the CEVA-TeakLite-4-based development platform encompasses processing, connectivity, sensing and application software. These are used as building blocks for prototyping IoT devices, Richard Kingston, VP marketing, CEVA explained at the Pinnacle European Press Summit in Munich, Germany.
Target markets are mobile, wearables and the smart home, he added. The platform is built around the company’s CEVA-TeakLite-4 DSP and sub-system implemented in SMIC’s 55nmLP process. Running at 500MHz, and with multiple peripherals (TDM, DMA, I²C, I²S, ICU, timers, GPIO) and system interfaces, the DSP allows designers to add ‘smart and connected’ capabilities to devices, including always-on sensing (contextual awareness both audio and motion), local, as opposed to cloud intelligence processing and connectivity using multiple standards, such as Bluetooth, Wi-Fi, ZigBee and GNSS. The platform also provides real-time power measurement that allows developers to optimise and power-tune their DSP software, says the company.
The host CPU has Linux running on-board an ARM Cortex-A9 for CPU and DSP system prototyping. Arduino connectors and drivers mean that Arduino Shields can be connected to the board, to leverage the Arduino-related ecosystem.
The company’s Android Multimedia Framework (AMF) offloads Android tasks from CPU to DSP to enhance always-on functionality and long audio playback time. Multi-tasking RTOS and a DSP library are also provided to speed system design.

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Linux update is scalable for the IoT

At this week’s Embedded Linux Conference, in Dublin, Ireland, Wind River announced that it has released Wind River Linux 8, which brings open source flexibility and interoperability, with scalability.

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Short range wireless transceivers are FCC- and IC-approved

Wireless eRIC modules by LPRS (Low Power Radio Solutions) have been approved for USA and Canadian markets. The easyRadio Integrated Controller transceiver module eRIC9-FCC, has been FCC- and IC-approved.

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Low power Bluetooth Smart opens up possibilities for wearables

Claimed to be the industry’s lowest power, smallest footprint Bluetooth Smart solution, the Atmel SmartConnect Bluetooth Smart BTLC1000 consumes less than 4mA in RX and less than 3mA TX at 3.6V. According to the company, it can increases battery life by as much as one year or more for certain applications.
The 2.2 x 2.1mm WLCSP is ‘unparalleled’ says the company and significantly smaller than alternatives available on the market today. The tiny, low-power SoC opens up possibilities for IoT and wearable markets, says the company, enabling applications such as fitness trackers and medical devices, along with human Interface devices, asset trackers and beacons.

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