CML Microcircuits is supporting the global market digital mobile radio with a development kit to help designers develop dual-mode (digital/analogue) radios for wearable and personal radio formats operating at up to 2.0 and 5.0W, for short- and medium-range transmissions respectively.
Wearable
Miniature logic package can be used without a step-down mask
Offering reduced assembly costs and increased reliability, Nexperia has developed a four-pin X2SON4 package. It is claimed to be the smallest logic package that can be used without requiring an expensive and fragile step-down mask. As a result, PCB assembly is quicker, easier, more reliable and more cost-effective, says Nexperia.
Wireless charging kit can lead to reduced form factor for IoT and wearable devices
Compact chargers for IoT and wearable devices can be reduced in size, using the STEval-ISB045V1 wireless battery-charger development kit, says the company. It lets users quickly build compact chargers, up to 2.5W, with a space-saving 20mm-diameter coil, for charging small smartwatches, sports gear, or healthcare equipment.
Microchip’s Bluetooth SoC combines Sony’s LDAC technology for audio devices
Today’s consumers expect Bluetooth audio devices to create an immersive and uninterrupted listening experience. Bluetooth audio designs, however, can be limited by the bit depth and frequency rate of existing codecs, the communication and compression technology used to send audio over the air. To bridge this divide, Microchip has developed a certified, Bluetooth 5-compliant system on chip (SoC) with Sony’s LDAC audio codec technology. Sony’s LDAC is considered the highest-quality audio codec available, reports Microchip. It transmits up to 990kbits per second data throughput, which is three times higher than the standard Bluetooth Sub-band Codec (SBC), and maintains frequency and bit depth of up to 96kHz/24-bit. The high compression and reproduction efficiency enables high-resolution audio listening experiences for Bluetooth audio devices, adds the company.
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