Weartech-Components & Hardware

Two axis motion during a single actuation of the test socket is provided by the Kepler contact technology. It has been developed by Smiths Interconnect, and is claimed to the only contact technology for IC testing to provide this will boosts first pass yield. It is also claimed to enhance production reliability and extend maintenance intervals.
The technology can be used for testing high performance computing, wearables or automotive chips, confirmed Smiths Interconnect.
Presently, the semiconductor test industry uses the traditional vertical spring probes for BGA, LGA, QFN, and QFP packaging testing, or cantilever scrubbing contact design has been used in peripheral segments to remove surface oxides and contaminants. Both technologies, however, require maintenance and performance monitoring to ensure optimal results during testing cycles.