Taoglas has announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimised for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 deliver exceptional performance in ultra-compact packages – with minimal keep out area – designed for next-generation IoT, consumer, industrial, and wearable applications where space, efficiency, and reliability are critical.
Wearable
Nordic Semi launches Wi-Fi 6 board to speed nRF54L IoT development
Nordic Semiconductor has announced the availability of the nRF7002 Expansion Board II (nRF7002 EBII). The nRF7002 EBII plug-in board adds Wi-Fi 6 capabilities to Nordic’s nRF54L Series Development Kits (DKs), enabling developers to create high performance, energy-efficient, Wi-Fi 6-enabled IoT solutions.
xMEMS to showcase µCooling and Sycamore MEMS loudspeaker technologies at CES 2026
xMEMS Labs has announced its participation at CES 2026 (January 6–9, Las Vegas, The Venetian, Suite 34-208), where it will demonstrate category-defining innovations for the fast-accelerating market of AI-enabled wearable and mobile devices.
Omnivision announces single-chip LCOS for latest generation smart glasses
Omnivision has launched the industry’s only single-chip liquid crystal on silicon (LCOS) small panel with ultra-low power for next-generation smart glasses. The OP03021 LCOS panel delivers a 1632 x 1536 resolution at 90 Hz in a compact 0.26-inch optical format, enabling next-generation smart glasses to achieve higher resolution with a wider field of view (FoV)—key features in demand by consumers to provide a more immersive, realistic and comfortable augmented reality (AR) experience as smart glasses experience widespread adoption.
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