ATP Electronics has become the first e.MMC manufacturer to further shrink the e.MMC size to 6.7 mm. Built on 125-ball Fine Ball Grid Array (FBGA), the new E700Pc / E600Vc solutions shatter dimension constraints, making them the world’s smallest and the first of its kind. As a further miniaturisation of the previous “smallest” package of 7.2 x 7.2 mm introduced in early 2025, the new e.MMC offerings are 67% smaller compared to standard-sized e.MMC while retaining advantages such as power savings and thermal resilience, making them ideal for applications where energy and space are premium considerations.
Wearable
Arrow supports .lumen in scaling production of Its glasses for the blind
Arrow Electronics is collaborating with Romanian startup .lumen to scale intelligent guide glasses designed to replicate the key functions of a guide dog.
Infineon introduces the industry’s first Wi-Fi 7 IoT 20 MHz tri-radio device optimised for IoT
To support continued growth of connected devices in home, industrial and commercial markets, Infineon has introduced the AIROC ACW741x, a new product family that integrates a tri-radio with Wi-Fi 7, Bluetooth LE 6.0 with Channel Sounding, and IEEE 802.15.4 Thread, with Matter ecosystem support in a single device. This product family introduces the industry’s first 20 MHz Wi-Fi 7 device for IoT, provides Wi-Fi 7 Multi-Link for IoT for enhanced robustness in congested environments and has the industry’s lowest Wi-Fi connected standby power.
Digid announces its nanoscale temperature and force sensors are ready for mass deployment
Digid has announced that its patented printed electronics fabrication technology has been fully qualified for volume production of temperature and force sensors as small as 1µm long.
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