Valuable space in wearable and hearable devices can be gained using the 20 and 30V MOSFETs in a DFN0603 package, said Nexperia. They are designed for miniature designed with artificial intelligence (AI) and machine learning (ML).
Wearable
MicroEJ’s development kit supports Android Studio and Gradle
The MicroEJ VEE Android compatibility kit by MicroEJ is designed for manufacturers of IoT and embedded devices to access the Android Studio ecosystem. MicroEJ VEE shares the same technology principles as Android and now also supports the development.
Quad-row board-to-board connectors offer space-saving connections
Molex has released its quad-row board-to-board connectors, which it claimed feature the industry’s first staggered-circuit layout for 30% space savings over conventional connector designs.
Renesas’ SmartBond DA1470x SoCs are integrated for wireless connectivity
Renesas Electronics has announced the SmartBond DA1470x family of Bluetooth low energy (LE) integrated SoCs for wireless connectivity.
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