The trend to miniaturise components to satisfy the ever-increasing demand for wearable and mobile devices has enabled a myriad of tiny yet functionality-packed ICs to be inserted onto a single PCB. However, one of the issues of working in these miniscule sizes has been the difficulty of research and development professionals checking prior to mass production whether on-board components meet the stringent quality requirements that ensure they will operate reliably and repetitively throughout the life of the device.