Infineon expands XENSIV MEMS microphone lineup

Infineon has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments.

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New ST  Bluetooth 5.4 / Thread module for smart and IoT applications now at Mouser

Mouser Electronics is now shipping the new ST67W Wi-Fi 6 / Bluetooth 5.4 / Thread module from STMicroelectronics. The ST67W Module simplifies the development of next-generation wireless solutions for smart homes, smart appliances, healthcare, and industrial IoT applications.

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Latest Bluetooth module from Panasonic now in mass production and supporting Bluetooth 6.0

Now in mass production, the PAN B611-1 Bluetooth module from Panasonic Industry is based on the powerful Nordic nRF54L15 single chip controller. The product now also supports Bluetooth 6.0 and the cutting-edge Bluetooth Channel Sounding feature, enabling precise distance measurement and improved wireless communication.

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Alif Semi release benchmark results from its latest GenAI enabled MCUs

Alif Semiconductor has released benchmarks on its latest E4, E6 and E8 microcontrollers and fusion processors.

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