Omnivision announces single chip LCOS panel for next-generation smart AR/XR/MR glasses

Omnivision has announced the new OP03050, a low-power, small form factor liquid crystal on silicon (LCOS) panel that integrates the LCOS array, driving circuit, framebuffer and interface in a single chip. The OP03050 provides a high-resolution, immersive experience for real-time video conferencing and streaming when used in augmented reality (AR), extended reality (XR) and mixed reality (MR) glasses and head-mounted displays.

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Skyworks’ advanced AI noise suppression enables highest audio quality for new audio/video applications on the Edge

Skyworks Solutions is introducing its newest software solution for removing unwanted background noise from speech signals at CES 2024. The AI Noise Suppression solution delivers a new benchmark of performance for noise reduction, increasing speech intelligibility, preserving quality and reducing listener fatigue when using handsets, headsets, conference systems, automotive telematics, wireless microphones and audio-visual systems.

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OKW’S body-case wearable plastic enclosures for IoT/IIoT

Growth in the IIoT mobile electronics segment is set to further boost demand for OKW’s BODY-CASE (IP 65) wearable plastic enclosures.

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Ceva extends its Connect IP Portfolio with Wi-Fi 7 platform for high-end consumer and industrial IoT

Ceva has announced the general release of its next generation RivieraWaves Wi-Fi 7 IP platform, further expanding its widely-licensed portfolio of connectivity IP, targeting high-end consumer and industrial applications including gateways, TVs, set-top-boxes, streaming media devices, AR/VR headsets, personal computing and smartphones. The RivieraWaves Wi-Fi 7 IP leverages all the latest advanced features of the IEEE 802.11be standard to deliver a premium high performance, cost- and power-optimised Wi-Fi solution for integration into the next wave of Wi-Fi Access Point (AP) and Station (STA) products.

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