Fujitsu offers die shrink FRAM for IoT

Fujitsu Electronics Europe announces the first product of a new die shrink FRAM generation, the MB85RS2MTA. 

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Intel announces 8th Gen Core Processors with Radeon RX Vega M Graphics

Offering a three-fold increase in the rate of frames per second, Intel introduces 8th Gen Intel Core processor with Radeon RX Vega M Graphics.

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3D image sensor unlocks smartphone with face recognition

The 3D image sensor chip from Infineon Technologies will make unlocking a mobile phone with 3D face recognition smarter, faster and more reliable, says the company. The unlocking method could replace fingerprint or PIN access and make authentication more convenient and more secure for mobile payment applications and mobile ID, speculates the company. 

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Pushbutton load switch ICs save battery power

Designed for mobile devices and others with small capacity batteries, the XC6192 series of pushbutton load switch IC from Torex Semiconductor have a power-save function.

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