Built in a 5nm extreme ultra-violet (EUV) process node, the Exynos W920- processor integrates an LTE modem and offers powerful yet efficient performance for wearable devices, according to Samsung.
ICs & Semiconductors
MEMS scanner allows AR to step up, says Infineon
Infineon Technologies has announced a MEMS scanner solution, comprising a MEMS mirror and MEMS driver. The miniature size and low power consumption are the basis for making AR solutions more widely available for consumer applications such as wearables and for automotive head-up displays.
Nexperia claims package advance accommodates more logic in small form factor
Claimed to be the world’s smallest and thinnest packages for standard logic devices, the DHXQFN packages save PCB area, says Nexperia. The company has introduced 14-, 16-, 20- and 24-pin DHXQFN packages, and claims they enable large logic functions to be included in small form factor systems.
Hand-held camera cube reference design brings AI to the edge
Artificial intelligence (AI) which was previously limited to expensive machines with large power budgets can now be embedded in space-constrained, power-powered edge devices. Maxim Integrated says its MAXREFDES178# camera cube executes low latency AI vision and hearing inferences on a coin cell power budget with reduced cost and size.
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