New NFC reader IC and modular kit from ST jumpstarts contactless designs

ST is making it easier to explore creative applications for contactless near-field communication (NFC) technology with a novel development kit featuring the new ST25R200 reader/writer IC. ST’s latest-generation ST25R200 NFC transceiver combines an advanced design for strong and clear wireless connections with low power consumption and controls for signal quality and power management.

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Rohm’s DAC chip for hi-res audio playback with exclusive HD monaural mode

Rohm has developed the 32-bit D/A converter IC (DAC chip) and evaluation board designed for flagship models in the MUS-IC series optimized for high-resolution audio playback.

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Nexperia’s new step-down DC-DC converters with lowest quiescent current enhance design flexibility

Nexperia has introduced a new series of step-down DC-DC converters featuring devices with stand-by and operating efficiency that offer engineers flexibility for designing various fixed and portable battery-powered applications across consumer, industrial and automotive end-markets.

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Infineon announces advanced MEMS-based ultrasound transducer

Infineon has made significant progress in developing the technology for capacitive micromechanical ultrasonic transducers (CMUT). The technology enables the company to manufacture the first integrated one-chip solution for MEMS-based ultrasonic transducer that offers a smaller footprint, improved performance, and higher functionality. Such integration makes the new device ideal for developing new ultrasonic applications and improving existing applications in consumer electronics, the automotive industry, and medical technology.

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