ICs & Semiconductors

The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5 MB and a RAM size of 256 kB.
An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.