ST has announced the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare.
ICs & Semiconductors
u-blox announces new Wi-Fi 6 modules for cost-conscious application
u-blox has announced MAYA-W5 and NORA-W5, two new Wi-Fi 6 module families designed to bring secure, reliable wireless connectivity to the next-generation IoT devices. Addressing applications across smart home and building, industrial automation, healthcare, asset tracking, and beyond, the new compact modules offer two distinctive architectures: MAYA-W5 as a host-based module and NORA-W5 as a stand-alone module, enabling flexibility and optimised design depending on customer preferences.
Infineon brings secured contactless payment to smart wearables
Infineon has introduced SECORA Connect X, a ready-to-integrate solution that enables customers to transform smart wearables into fully functional payment devices. Combined with Infineon’s new SECORA Wallet and SECORA Token Requestor integrated to Mastercard (MDES) and Visa (VTS), it enables the digitisation of cards and the creation of a custom-branded wallet app. This new SECORA one-stop-shop for wearable payment accelerates time-to-market through seamless integration and certification, while offering flexible design, card tokenisation, and secured payment functionality for any active wearable.
Infineon expands CoolGaN family to deliver up to 82 percent footprint reduction
Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by up to 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of modern smartphones, notebooks, and wearables, this is a significant and quantifiable step forward. Targeting compact consumer devices, the new devices give power system designers greater flexibility to optimise efficiency and streamline designs without sacrificing performance.
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