The newly launched small and cost-effective PAN B511-1C Bluetooth module from Panasonic Industry features great performance and great memory while minimising current consumption based on the Nordic nRF54L15 single chip controller.
A dedicated number of GPIOs is positioned at the edge of the module, with the rest of the GPIOs located at the bottom pad. In total, the module provides access to all 32 GPIOs of the chip. Despite its hybrid packaging of castellated holes and LGA, the module remains at the small size of a 2-cent coin. This way, it combines the advantages of both worlds without compromising on size and enables one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module also features an embedded microcontroller and ARM Cortex- M33 with a high amount of flash memory of 1.5 MB and a RAM size of 256 kB.
An output power of 8dbm makes the module ideally suited for the European market. The main target applications are lighting, home appliances, industrial sensors, medical devices, healthcare wearables and energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct spec variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now and the start of mass production is scheduled for June 2025.
ICs & Semiconductors
u-blox expands its NORA-B2 Bluetooth LE modules series to address all mass market segments
u-blox has expanded its portfolio by introducing six new variants of the NORA-B2 Bluetooth Low Energy modules. Now integrating the entire range of Nordic Semiconductor’s next-level nRF54L Series of ultra-low power wireless Systems-on-Chip (SoCs), NORA-B2 offers a versatile solution for mass market segments thanks to its choices of antennas, architectures and chipsets.
Upgraded sensor board from ST accelerates plug-and-play evaluation
ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. is now upgraded with an STM32H5 microcontroller, USB-C connector, and extra digital interfaces including I3C for flexible communication , the new board lets users quickly evaluate sensors and handle demanding projects.
Infineon launches the world’s smallest eSIM solution for mobile consumer devices
Wearables, smartphones, tablets: In the consumer sector in particular, the demand for ever greater functionality, simplicity, and battery lifetime is increasing. Infineon Technologies contributes to these requirements with the introduction of the OPTIGA Connect Consumer OC1230. It is the world’s smallest GSMA-compliant and first 28 nm eSIM solution. OPTIGA Connect Consumer allows up to 50 percent less energy consumption compared to eSIMs on the market, extending the lifetime of the device’s battery without compromising on performance. It also contributes largely to more convenience since eSIMs can be managed remotely, making haptic SIM changes abundant thus saving time and resources and allowing for greater flexibility. Smartphone users can switch between different providers more easily, manufacturers can be more flexible in their design since physical access is not required. This can be a large advantage in IoT devices. Above all, OPTIGA Connect Consumer OC1230 is ideal for consumer devices such as smartphones, tablets, and notebooks, and even for small devices such as smartwatches and other wearables as well as 5G routers and POS payment terminals.
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