New short-range wireless point-to-point transceiver ICs from STMicroelectronics remove the need for cables and connectors in consumer-friendly accessories and personal electronics like digital cameras, wearables, portable hard drives, and small gaming terminals. They also address data-transfer challenges in industrial applications such as rotating machinery.
ICs & Semiconductors
Infineon introduces lower cost Bluetooth long-range module for low power applications
Infineon has announced the CYW20822-P4TAI040, its latest Bluetooth module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics. This module offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high performance, Infineon’s CYW20822-P4TAI040 is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart home, asset tracking, beacons and sensors, and medical devices.
u-blox introduces new LTE-M modules with integrated GNSS to boost industrial connectivity
u-blox has announced two new LTE-M cellular module series, the SARA-R52 and LEXI-R52. These modules, designed for industrial applications, are based on the u-blox UBX-R52 cellular chip and are tailored for integrated and concurrent positioning and wireless communication needs. Typical IoT use cases include fixed and mobile applications such as metering and utility, asset tracking and monitoring, as well as healthcare.
HaiLa showcases first Wi-Fi-based extreme-low-power backscatter chip
HaiLa Technologies has announced the availability of the BSC2000 RF evaluation chip development and demonstration kits. Presto Engineering successfully collaborated with HaiLa to develop the first complete analog and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.
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