NXP Semiconductors has announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
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ST’s sensor and secure wireless technologies support Snapdragon Wear Elite
ST now supports leading-edge motion-sensing and secure wireless technologies on Qualcomm Technologies’ newly launched personal AI platform, Snapdragon Wear Elite. ST components help unlock always on sensing, unprecedented power efficiency, and breakthrough user experiences for the next generation of truly personal, responsive wearable computing devices, enabling advanced use cases like activity recognition and health and lifestyle monitoring.
Rutronik expands its storage portfolio with KIOXIA e-MMCs for industrial and consumer applications
With KIOXIA’s e-MMC memory solutions, Rutronik offers compact and powerful embedded components based on the BiCS FLASHTM generation 5 TLC 3D flash memory. The e-MMCs are available in 64 GB (THGAMSG9T15BAIL_TRAY / THGAMSG9T15BAIL_REEL) and 128 GB (THGAMST0T25BAIL_TRAY / THGAMST0T25BAIL_REEL) and support the JEDEC e-MMC 5.1 protocol, operate with an I / O voltage of 1.8 V and achieve transfer rates of up to 340 MB / s (read) and 230 MB/s (write) in HS400 mode. The memory solutions are specified for a wide temperature range from -25 °C to +85 °C.
ATP unveils world’s smallest 6.7 mm e.MMC to power next-gen smart wearables
ATP Electronics has become the first e.MMC manufacturer to further shrink the e.MMC size to 6.7 mm. Built on 125-ball Fine Ball Grid Array (FBGA), the new E700Pc / E600Vc solutions shatter dimension constraints, making them the world’s smallest and the first of its kind. As a further miniaturisation of the previous “smallest” package of 7.2 x 7.2 mm introduced in early 2025, the new e.MMC offerings are 67% smaller compared to standard-sized e.MMC while retaining advantages such as power savings and thermal resilience, making them ideal for applications where energy and space are premium considerations.
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