With KIOXIA’s e-MMC memory solutions, Rutronik offers compact and powerful embedded components based on the BiCS FLASHTM generation 5 TLC 3D flash memory. The e-MMCs are available in 64 GB (THGAMSG9T15BAIL_TRAY / THGAMSG9T15BAIL_REEL) and 128 GB (THGAMST0T25BAIL_TRAY / THGAMST0T25BAIL_REEL) and support the JEDEC e-MMC 5.1 protocol, operate with an I / O voltage of 1.8 V and achieve transfer rates of up to 340 MB / s (read) and 230 MB/s (write) in HS400 mode. The memory solutions are specified for a wide temperature range from -25 °C to +85 °C.
Embedded
ATP unveils world’s smallest 6.7 mm e.MMC to power next-gen smart wearables
ATP Electronics has become the first e.MMC manufacturer to further shrink the e.MMC size to 6.7 mm. Built on 125-ball Fine Ball Grid Array (FBGA), the new E700Pc / E600Vc solutions shatter dimension constraints, making them the world’s smallest and the first of its kind. As a further miniaturisation of the previous “smallest” package of 7.2 x 7.2 mm introduced in early 2025, the new e.MMC offerings are 67% smaller compared to standard-sized e.MMC while retaining advantages such as power savings and thermal resilience, making them ideal for applications where energy and space are premium considerations.
Taoglas expands compact chip antenna range for Wi-Fi 6/7, UWB and ISM applications
Taoglas has announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimised for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 are designed for next-generation IoT, consumer, industrial, and wearable applications.
Nordic Semi launches Wi-Fi 6 board to speed nRF54L IoT development
Nordic Semiconductor has announced the availability of the nRF7002 Expansion Board II (nRF7002 EBII). The nRF7002 EBII plug-in board adds Wi-Fi 6 capabilities to Nordic’s nRF54L Series Development Kits (DKs), enabling developers to create high performance, energy-efficient, Wi-Fi 6-enabled IoT solutions.
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