Nexperia has announced two enhancements to its extensive Zener diode portfolio that both eliminate undesirable overswing and noise behaviour – making a major advancement in Zener technology. Firstly, the new 50 µA-Zener series with B-selection (Vz +/-2%) and Vz ranging from 1.8 V to 51 V is offered in standard and automotive qualified variants. Making them ideal for automotive applications like on-board chargers in electric vehicles (EV) as well as for a broad range of industrial and consumer applications like general-purpose computing units, battery management systems, device chargers and smartwatches.
Automotive
Infineon expands its Bluetooth portfolio with eight new parts
Infineon has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimised for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.
New low-cost option for high-speed 4K video display interfacing from GOWIN
GOWIN Semiconductor has launched the GW5AT-15 FPGA to provide a programmable high-speed bridging solution for demanding consumer electronics and automotive use cases such as 4K video transfer at high frame rates up to 120 frames/s.
The new GW5AT-15, the latest member of the Arora-V FPGA family, combines various hard-core SerDes transceivers with high-speed memory and 15,120 logic elements. The product is available in package options including a compact 4.9mm x 5.3mm WLCSP, which offers maximum SerDes throughput of 12.5Gbps.
The features of the GW5AT-15 are ideal for an emerging set of use cases which call for very high bandwidth for video and other data-transfer applications, and which require a small board footprint – examples include consumer tablets, augmented/virtual reality headsets, and car infotainment systems.
The high SerDes bandwidth offered by the GW5AT-15 makes it ideal for use in high-speed interfaces. This new FPGA features:
• 3-lane MIPI C-PHY operating at up to 5.75Gbps/lane
• 4-lane PCIe 3.0
• 4-lane MIPI D-PHY operating at up to 2.5Gbps/lane
The GW5AT-15 also supports high-speed USB Type-C and other USB connections with its on-chip USB 3.x and USB 2.x PHYs.
The high throughput offered by the GW5AT-15 supports gamers’ requirement for high frame-rate 4K video in the latest consumer tablet designs. In vehicle infotainment systems, the GW5AT-15’s provision of high-speed USB and other interfaces enables cars to better emulate the smartphone user experience through applications such as the Android Auto or Apple CarPlay software companions.
All SerDes operations are backed by co-packaged fast memory resources including:
• 118kb of shadow SRAM
• 630kb of block SRAM (BSRAM) arranged as 35 x 18kb
• Optional 64Mb (in MG132P package) or 128Mb (in CM90P package) of pseudo SRAM (pSRAM)
• Optional 8Mb of NOR Flash
The FPGA also features two on-chip PLLs, multiple clock sources, a JPEG codec, and an ADC.
Like the other members of the Arora-V family, the GW5AT-15 is built on a low-power 22nm TSMC process. It is backed by the GOWIN EDA FPGA design environment, which includes an FPGA design tool, IP cores and reference designs. The FPGA design tool supports the SystemVerilog, Verilog and VHDL programming languages.
HaiLa showcases first Wi-Fi-based extreme-low-power backscatter chip
HaiLa Technologies has announced the availability of the BSC2000 RF evaluation chip development and demonstration kits. Presto Engineering successfully collaborated with HaiLa to develop the first complete analog and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.
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