POLYN Technology announces first silicon-implemented NASP chip

POLYN Technology has announced the successful manufacturing and testing of the world’s first silicon-proven implementation of its unique NASP (Neuromorphic Analog Signal Processing) technology.

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Infineon announces advanced MEMS-based ultrasound transducer

Infineon has made significant progress in developing the technology for capacitive micromechanical ultrasonic transducers (CMUT). The technology enables the company to manufacture the first integrated one-chip solution for MEMS-based ultrasonic transducer that offers a smaller footprint, improved performance, and higher functionality. Such integration makes the new device ideal for developing new ultrasonic applications and improving existing applications in consumer electronics, the automotive industry, and medical technology.

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Renesas introduces new AnalogPAK programmable mixed-signal ICs

Renesas has announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).

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Nexperia enhances Zener diode portfolio to address overswing and noise phenomena

Nexperia has announced two enhancements to its extensive Zener diode portfolio that both eliminate undesirable overswing and noise behaviour – making a major advancement in Zener technology. Firstly, the new 50 µA-Zener series with B-selection (Vz +/-2%) and Vz ranging from 1.8 V to 51 V is offered in standard and automotive qualified variants. Making them ideal for automotive applications like on-board chargers in electric vehicles (EV) as well as for a broad range of industrial and consumer applications like general-purpose computing units, battery management systems, device chargers and smartwatches.

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