Synaptics has extended its Veros Triple Combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for the embedded Edge AI Internet of Things (IoT), the SYN461x is optimised for power, system integration, size, and rapid time to market while delivering rate-over-range performance and seamless interoperability. The versatile Matter-compliant SoCs offer advanced Bluetooth features, such as Channel Sounding and LE Audio—including Auracast. The SYN461x specifically targets consumer and industrial applications and is tailored for devices such as wearables, smart watches, audio speakers and headsets, home appliances, security cameras, asset trackers, and factory automation.
AI
Infineon announces PSOC 4 Multi-Sense expanding capacitive sensing technology
Infineon has expanded its capacitive sensing technology CAPSENSE with a new, proprietary inductive sensing technology, as well as a non-invasive and non-contact liquid sensing solution. With PSOC 4, developers now have endless possibilities to develop new HMI and sensing solutions. From sleek metallic product designs with touch on metal buttons, to waterproof touch buttons, and innovative ways of sensing liquids, PSOC 4 Multi-Sense unlocks new possibilities of sensing.
Microchip releases 20 Wi-Fi products for industrial and commercial applications
With Industry 4.0, the rapid rise of Artificial Intelligence (AI), digitised manufacturing and the age of IoT everything, the demand for wireless connectivity in commercial and industrial applications is growing at an exceptional pace. These applications typically require reliable connectivity that can withstand extreme environments that are exposed to high temperatures, background noise and obstructions. To help meet this need, Microchip Technology has added 20 products to its Wi-Fi® portfolio.
ST reveals Page EEPROM two-in-one memory to boost smart-edge performance and efficiency
ST’ Page EEPROM combines the power efficiency and durability of an EEPROM with the capacity and speed of a Flash memory, creating a hybrid memory for applications that face extreme size and power constraints.
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