Ceva Bluetooth low energy IPs bring ultra-low power wireless connectivity

Ceva has announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers.
The Balletto family is a complete Edge AI/ML microcontroller solution for connected IoT platforms with integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem and a dedicated network co-processor, enabling connectivity and machine learning in a single chip. The Balletto family delivers up to 50x boost in machine learning performance and inference efficiency versus traditional MCUs that lack neural co-processors. The Ceva-Waves Bluetooth Low Energy IP provides Balletto MCUs with the robust connectivity at ultra-low power consumption, and supports Bluetooth LE Audio and Auracast broadcast audio, for customers who wish to leverage Balletto to create highly differentiated wireless audio products. The Balletto family also relies on Ceva-Waves 802.15.4 IP for Thread, Zigbee and Matter support in smart home applications.

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Mouser now stocking ST biosensor for smart devices and wearables

The ST1VAFE6AX provides design engineers with next generation biopotential signal detection and motion tracking for a variety of applications, including heart rate, pulse monitoring, electrocardiogram (ECG) and activity tracking for wearables and portable medical devices.

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ST BrightSense image sensor ecosystem for advanced camera performance

ST has introduced a set of plug-and-play hardware kits, evaluation camera modules and software that ease development with its ST BrightSense global-shutter image sensors. The ecosystem lets developers of mass-market industrial and consumer applications ensure superior camera performance by designing-in ST BrightSense image sensors. By sampling all pixels simultaneously, unlike a conventional rolling shutter, global-shutter sensors can capture images of fast-moving objects without distortion and significantly reduce power when coupled to a lighting system.

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Alif launches an MCU with AI/ML processing in a tiny footprint

Alif Semiconductor has launched the Ensemble E1C, an MCU series which combines rich digital and analog capabilities with a low-power on-chip neural processing unit (NPU) in a new compact form factor.
This new Ensemble family MCU, which combines a 160MHz Arm Cortex-M55 CPU core with Helium vector processing extension, an Arm Ethos-U55 NPU generating up to 46 GOPs, and up to 2MB of tightly coupled SRAM, is available in a tiny WLCSP package occupying a footprint of 3.9mm x 3.9mm.
The introduction of the E1C extends the Ensemble family, providing a new entry-level option for OEMs that want AI performance and ultra-low power consumption implemented in a familiar Arm environment. The new E1C also shares the same architecture as the Balletto family, allowing for software re-use across the entire family, and easy migration of applications from one device to another.
The E1C can perform both AI/ML and application control functions at ultra-low power levels. This means manufacturers can bring advanced ML capabilities to products such as wearable devices that have extreme constraints on power and space. The E1C’s capabilities are optimised for local ML workloads such as object recognition, speech recognition, sensor fusion, and adaptive audio noise cancellation, easing heavy dependence on the cloud to provide a better user experience.
The high AI performance of the E1C is matched by its power efficiency. The E1C’s aiPM technology can dynamically power only the logic and associated memory that are in use at any given time, thus achieving the lowest overall system power consumption. The aiPM power management unit implements four system-level power modes including a Stop mode which draws just 700nA.
The Ethos-U55 NPU performs 128 MACs/cycle to give ML output of 46 GOPS, and enables on-the-fly weight decompression. This results in inferencing performance some 100x faster and more power-efficient than competing MCUs based on an Arm Cortex-M4 CPU provide. The E1C’s digital cores are backed by up to 2MB of MRAM non-volatile memory alongside up to 2MB of zero wait-state SRAM. A high-speed OctalSPI interface enables expansion to external memory if required. Versions of E1C devices are offered with and without the NPU.
The E1C features a rich set of analog and connectivity peripherals. Two 12-bit SAR ADCs and a 24-bit sigma-delta ADC, a 12-bit DAC and an internal reference voltage provide for fast, precise processing of signals from external sensors. Outputs can be displayed on rich colour displays using a MIPI DSI display interface.
A broad selection of serial communications interfaces includes USB 2.0, SDIO, 2x CAN FD and I3C. Designers of connected devices can also benefit from the same low-power and high-performance characteristics of the E1C with the addition of built-in Bluetooth Low Energy connectivity by choosing the Balletto B1, launched by Alif on 9 April 2024.
Security is a core attribute of the Ensemble family, and the E1C shares the same architecture. Its advanced secure enclave, which provides a solid hardware root-of-trust enabling secure key generation and storage, secure boot, cryptographic accelerators, and certificate management, eliminates the need for an external Secure MCU in endpoint AI devices.

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