Registration now open for Microchip’s European MASTERs conference

Microchip Technology has announced that registration is now open for its European MASTERs Conference, an in-person technical training event for embedded control engineers. The conference will take place October 12–15, 2026, at the Westin Grand Munich in Munich, Germany. MASTERs is an acronym for Microchip Annual Strategic Technical Exchange and Review and is curated to provide engineers with peer-to-peer technical training led by Microchip subject-matter experts.

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Farnell’s “Top Tech Voices” podcasts explore curiosity, AI and the future of human-centred cities in latest episodes

Farnell’s Top Tech Voices podcast continues its season with two new episodes featuring neuroscientist and founder Dr Anne-Laure Le Cunff and architect and MIT Professor Carlo Ratti.

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Infineon launches EU flagship project Moore4Power to drive the next generation of sustainable power electronics

Today marks the official launch of Moore4Power (More than Moore for Disruptive Innovations in Power Electronics), one of Europe’s most ambitious semiconductor R&D projects. Led by Infineon Technologies, this Chips Joint Undertaking initiative unites large entities, small and medium-sized enterprises and research institutes from 15 European countries to develop the next generation of smart, efficient and sustainable power electronics. With a total project volume of €91 million, Moore4Power will run for three years aiming to deliver breakthrough innovations that strengthen Europe’s technological sovereignty and sustainability in the field of power electronics.

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OE-A publishes 10th edition of the Roadmap for Flexible and Printed Electronics

With the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry. The roadmap offers a comprehensive overview of the current state of the industry as well as the future prospects for flexible and printed electronics.

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