3D spatial audio allow motion-aware hearables
3D spatial audio technology company, VisiSonics and wireless IP company, Ceva, have collaborated to develop 3D spatial audio for embedded devices, including true wireless audio (TWS) ear buds, headphones and other hearables.
VisiSonics’ RealSpace 3D audio software is optimised for Ceva’s low power audio and sensor hub DSPs together with Ceva’s MotionEngine head tracking algorithms running on its BNO080 nine-axis system in package (SiP). The 3D audio for SoC vendors, OEMs and ODMs for virtual reality / augmented reality (VR / AR) and the new generation of motion-aware ear buds which uses 3D audio.
The VisiSonics RealSpace 3D Embedded for Headphones technology incorporates a suite of algorithms that give the listener a feeling of being present in a three-dimensional acoustic scene. This patented and proprietary technology allows one to precisely place auditory objects in virtual auditory space including both ambisonics and object based input, as envisaged in the Dolby Atmos and MPEG-H standards, says Ceva. It also enables personalised head-related transfer functions and interfaces with Ceva’s MotionEngine head tracking to give solid images of the auditory scene. Ceva says its audio and sensor hub DSPs, such as the CEVA-X2, CEVA-BX1, CEVA-BX2 and SensPro family, enable the suite of algorithms to run seamlessly in an extremely low power footprint.
The scalable audio and sensor hub DSPs are optimised for sound processing applications from always-on voice control to multiple sensors fusion. They have been specifically designed to tackle multi-microphone speech processing, audio playback and post-processing as well as on-device sound neural network implementations. A third party ecosystem of audio/voice software, hardware and development tools is also available for Ceva DSPs.
VisiSonics’ technologies for the rendering, capture and personalisation of 3D sound are licensed and incorporated by companies worldwide.
Ceva claims to be the leading licensor of wireless connectivity and smart sensing technologies. It offers DSPs, AI processors, wireless platforms and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. The company partners with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for mobile, consumer, automotive, robotics, industrial and IoT. The company’s low power IP includes DSP-based platforms for 5G baseband processing in mobile and infrastructure, advanced imaging and computer vision for any camera-enabled device and audio/voice/speech and low power always-on/sensing applications for the IoT markets. For sensor fusion, Ceva’s Hillcrest Labs sensor processing technologies provide sensor fusion software and IMU for AR/VR, robotics, remote controls, and IoT. There are also AI processors capable of handling neural network workloads, on-device and for wireless IoT, there are IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT.